| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53943
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53183 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B25B27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-1061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R33-76 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B25B27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00 |
| filingDate |
2003-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b86f2f87193b5cfbe073fd0a53a035e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f28b31ee17700fdc0d529e959f853a69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1c0428f9d22441464dde874a1826e68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98671fe4f188ebc668d12e099dd2577c |
| publicationDate |
2004-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200416928-A |
| titleOfInvention |
Method of attaching electronic component and electronic component attaching tool |
| abstract |
An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket. |
| priorityDate |
2002-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |