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filingDate 2003-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200416236-A
titleOfInvention Material composition for packaging photo-sensitive elements and method of using the same
abstract The invention pertains to a material composition for packaging. The composition comprises (1) an epoxy resin and (2) a curing agent, wherein the mixing ratio of said epoxy resin to said curing agent is in the range from 0.7 to 1.1. The invention also pertains to a method of using said material composition for packaging a photo-sensitive element on a substrate.
priorityDate 2003-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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