http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200411682-A

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filingDate 2003-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70c799e37d87126eb946b21e98ace008
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publicationDate 2004-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200411682-A
titleOfInvention Chip-shaped electronic component and manufacturing method thereof
abstract The chip-shaped electronic component of the present invention includes a component main unit comprising zinc-oxide material layers and an internal electrode layers. If the shortest distance from the outermost layer of the laminated internal electrode layers to the surface of the component main unit is 1, the ionic strength ratio between lithium and zinc (Li/Zn) tested according to Secondary Ion Mass Spectrometry (SIMS) in a range from the surface of the component main unit to a depth (0.9x1) should be between 0.001 and 500 (0.001≤Li/Zn≤500). According to the invention, it is possible to provide a chip-shaped electronic component, such as a multi-layer chip varistor, not requiring glass coating or other insulative protective layer, being tolerant of temperature changes, capable of maintaining high resistance of an element surface even by reflow soldering, being highly reliable, and capable of being easily produced.
priorityDate 2002-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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