| abstract |
An entirely molded semiconductor device in which a flexible sheet having a conductive pattern is employed as a supporting substrate and semiconductor elements are mounted thereon has been developed, wherein such a semiconductor device has problems, such as no multi-layered connection structure is enabled, and warping of insulation resin sheets becomes remarkable in the manufacture process. Therefore, a method of manufacturing a circuit device is proposed to solve the above- mentioned problems, wherein an laminated plate 10 obtained by laminating a thin first conductive film 11 and a thick second conductive film 12 through a third conductive film 13 is employed, the thin first conductive film 11 is then etched to form a finely- patterned conductive pattern layer 11A, and after that the conductive pattern layer 11A is used as a mask to overetch the third conductive film 13 to form anchor portions 15 where a insulation adhesion layer 16 and a sealing resin layer 22 will bite into so as to strengthen the bonding of the insulation adhesion layer 16 and the sealing resin layer 22 with the conductive pattern layer 11A. |