| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48faa1622ea0e0b6df265e111b2cc70e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-388 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K19-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K19-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69acd7d9706fe6e8e0f239583afbb9e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edf4df64733783faaf8247f180382f92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d99be27661b73f76fe4fe3d9b22b6ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12b44a74fc57af65317de44d17efcd37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d4710cd91fb975482d9330fc9f05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2873d2c27e61c5bfe573715ac43021 |
| publicationDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200409305-A |
| titleOfInvention |
Thermally-conductive epoxy resin molded article and method of manufacturing the same |
| abstract |
A thermally-conductive epoxy resin molded article conducting heat generated from electronic components and the like, and a method of manufacturing the same are disclosed. The thermally-conductive epoxy resin molded article according to the present invention is obtained by curing an epoxy resin composition containing an epoxy resin. The epoxy resin contained in the thermally-conductive epoxy resin molded article has the degree of orientation α equal to or larger than 0.5 and smaller than 1.0. The degree of orientation α is determined by the following equation: degree of orientation α = (180-Δβ)/180 … (1) wherein Δ β represents a half-width of a peak in an intensity distribution measures by fixing to a peak scattering angle in an x-ray diffraction measurement, and then changing an azimuth angle from 0 degree to 360 degrees. |
| priorityDate |
2002-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |