| abstract |
The present invention provides a surface treating agent for improving the solder wettability and anti-oxidation ability of tin alloy. Furthermore, the present invention also provides a surface treating agent, which enables a solder paste with high storage stability, and a tin alloy in which the whisker formation being inhibited. Said surface treating agent is characterized in comprising acid phosphate ester, and/or its salt, and is useful for treating tin alloy, the said acid phosphate ester containing one or two saturated or unsaturated alkyl group. The present invention provides a method using said surface treating agent for treating tin alloy. The preferred tin alloy is the solder alloy containing any one or two or more metal of Zn, Bi, Cu, Ag, Sb in Sn. |