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filingDate 2002-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200408104-A
titleOfInvention System-in-a-package
abstract A system-in-a-package mainly comprises a first package, a second package and an intermediate-carrier. The intermediate-carrier includes an opening, at least a via and a plurality of conductive-traces layers. The via has a side-wall, and a plurality of conductive layers which is formed on the side-wall and connected with the corresponding conductive-traces layers. The second package is disposed in the opening and electrically connects with the first package through the intermediate-carrier. At least an insulator is formed in the via, and the conductive layers are separated from each other. After the intermediate-carrier is interposed between the first package and the second package, the first package will electrically connect with the second package through the split-via with multi-conductive-layers of the intermediate-carrier for providing more conductive devices at the space between the intermediate-carrier, the first package and the second package in order to provide more electrical paths.
priorityDate 2002-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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