patent/TW-200408057-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200408057-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4ff9ddf728a7e1a0b36c9cc38b89ad6
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-484 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85444 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10157
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
classificationIPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
filingDate	2003-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c550c15ca38c1ffce79f27185d261209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b56097fe7f21a36e054b68f306a13992 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e98f01531a3da6bab1f859d2c04938b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a35223e9e8ec841737de25961eb2d5a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_362da9e2bbbb1626aa5e9016963569aa
publicationDate	2004-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-200408057-A
titleOfInvention	Manufacturing method of mounting body, semiconductor device and mounting body
abstract	The objective of the present invention is to provide a manufacturing method to reduce the grounding impedance of mounting body. It comprises: the engineering to form semiconductor device in the plural semiconductor chip regions on the main surface of the semiconductor substrate, and the grounding pad 11 of the grounding wiring in the semiconductor device; the engineering to form the separation groove 32 physically in the separation region of the plural semiconductor chip regions for separation; the engineering to form the grounding metal layer 26 in the separation groove 32 to connect to the grounding pad 11 of the semiconductor device; the engineering to polish the back side of the semiconductor substrate till exposing the bottom of the separation groove, and separate the plural semiconductor chip regions into individually independent semiconductor chips 21; the engineering to form conductive material at the ground location on the surface installed on the mounting substrate; and the engineering to connect the metal layer 26 and ground through conductive material for carrying the semiconductor chip 21.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10916508-B2
priorityDate	2002-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426147166 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID126527

Total number of triples: 72.