http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200405786-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4694
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2003-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76a5fe3304e5f90cfa2b2bde76c58f28
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publicationDate 2004-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200405786-A
titleOfInvention Manufacturing method of multi-layer printed circuit board and multi-layer printed circuit board
abstract The purpose of the present invention is to provide manufacturing method of multi-layer printed circuit board (PCB) with high productivity and workability at low cost without requiring a roughening step consuming a large quantity of chemicals imposing a heavy burden to the environment. The invented manufacturing method of multi-layer printed circuit board is characterized in comprising steps: coating opposite sides of an inner layer circuit board having a circuit formed therein with a resin composition containing (A) epoxy resin, (B) an epoxy resin curing agent and (C) an organic solvent having a boiling point not lower than 100 DEG C as essential components using a vertical suspension roll coater; drying the coating thus obtained, laying a copper foil applied or not applied with resin on the dried coating; and integrally molding them by hot press under vacuum or normal pressure using a hot plate press.
priorityDate 2002-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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