| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-00 |
| filingDate |
2003-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_541d99c86a90b33ea9a4ba7c25223829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7c2244db2edb1d2c3a9dd131cc1b954
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37fbef85817fbb54be8ddabead046644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abd919855348ee98c24fd8f71e783be6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3350609f60e95fa199b2ee86edd833ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70c4bd13c0eca3ed6f853c48351485d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c83858dfbd89cb5849f0db652644bb02 |
| publicationDate |
2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200403121-A |
| titleOfInvention |
Polishing apparatus and polishing method |
| abstract |
The present invention provides techniques related to polishing apparatus and polishing method, of which the objective is to maintain current density distribution substantially constant in the wafer plane while suppressing variation in the composition of electrolyte between a wafer and a counter electrode. The polishing apparatus in accordance with the present invention planarize a plane being polished by electrolytic abrasive polishing combining electropolishing and mechanical polishing, and is characterized by comprising a voltage applying means disposed oppositely to the plane being polished, and means for discharging foreign matters existing between the voltage applying means and an object being polished. As such, the problems with inconsistent electrolyte and non-distribution of current density may be resolved. |
| priorityDate |
2002-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |