| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-12 |
| filingDate |
2003-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a9d577d98b8a1d82f9faba8c97f91f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b81bd32473d14b3a330507072ce3746
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac57dd9f57e11bc7d09b081b2f67bb8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76ea7186b73038ddd3ba5e696da9698d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6ff4957eea71c9319de88bf2de947ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f457751671e42182dd7b9d4695921e2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7cc003afe7294a60c7836781cfdfdd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84e143f18cedc60e3aab14f2124bfe09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05f7fac406cde941ec15451ab67c59b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c941e1cde0b5d2ce71caad3e1a51639 |
| publicationDate |
2004-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200402351-A |
| titleOfInvention |
Method and apparatus for heating polishing pad |
| abstract |
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I476070-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I566883-B |
| priorityDate |
2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |