| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate |
2003-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_651be83f267b64f9c8155d61c6306b6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6702837054f6f1a4ca58e101eb85b2ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf504410ff77bb35e8d9e615edcbf1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ba3614f1bc0c1d9ca092a762c2a3502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c38de5518f1e313c2d0f7115eb2314fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83f76a8cce44513d4ef9bf66acb25646 |
| publicationDate |
2004-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200402255-A |
| titleOfInvention |
Multi-layered wiring board, its manufacturing method, semiconductor device and wireless electronic apparatus |
| abstract |
The purpose of the present invention is to provide a multi-layered wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its manufacturing method, a semiconductor device mounting a semiconductor chip on the multi-layered wiring board, and a wireless electronic apparatus mounting the semiconductor device. |
| priorityDate |
2002-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |