| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2003-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70c4bd13c0eca3ed6f853c48351485d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_541d99c86a90b33ea9a4ba7c25223829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9a91d36826255f77268709731dab477 |
| publicationDate |
2004-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200402097-A |
| titleOfInvention |
Method for producing metal film |
| abstract |
The present invention is able to obtain electrolytically polished surface of a copper plating film exhibiting excellent surface smoothness by eliminating current concentration due to an additive (especially, brightener) remaining or deposited with high concentration at a crystal grain boundary triple point or a wiring trench part on the surface layer of the copper plating film and further suppressing an elution. The solution of the present invention is to provide a method for producing a metal film, which comprises the steps of: forming a metal plating film (copper plating film 15) using a plating liquid added with a plating additive for suppressing generation of void, bottom up fill and over fill; and polishing the metal plating film electrolytically using an electrolytic polishing liquid added with a polishing additive reacting on or bonding to the plating additive component contained in the surface layer of the copper plating film or deposited thereon. |
| priorityDate |
2002-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |