http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200401850-A

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filingDate 2003-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3749ef4fdfcaffd25f4a36a7eaad26c
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publicationDate 2004-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200401850-A
titleOfInvention Copper foil with a carrier, method for manufacturing the copper foil with a carrier, and copper clad laminate employing the copper foil with a carrier
abstract The present invention provides a copper foil with a carrier, which can be drilled with carbon dioxide laser without a nickel auxiliary metal layer or an organic material film positioned on a surface of an outer layer copper foil of a copper clad laminate, which nickel auxiliary metal layer or an organic material film being for enhancing absorption of laser beam. To this end, it is employed a copper foil with a carrier foil and the like, which comprises: a copper foil having at one side of a bulk copper layer thereof a nodular-treated side; and a carrier foil, for manufacturing a printed wiring board, and the copper foil and carrier foil having an adhesive interface layer interposed therewith are laminated on a side opposite to the nodular treated side of the bulk copper layer. The copper foil with a carrier foil is characterized by the bulk copper layer consisting of high-carbon content copper, which contains carbon of 0.03 wt%- 0.40%.
priorityDate 2002-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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