http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200401402-A

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filingDate 2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14ef61e20f384f2875854352275c15fb
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publicationDate 2004-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200401402-A
titleOfInvention Structure of metal-metal capacitor
abstract A structure of metal-metal capacitor and the method for fabricating the metal-metal capacitor (MMC) is presented. Wherein the lower electrode of the metal-metal capacitor is located in the uppermost layer of said semiconductor structure. A bonding pad employed as the connection of the semiconductor structure and the outside can be fabricated with the upper electrode of said metal-metal capacitor. The above-mentioned process can fabricate a metal-metal capacitor over the uppermost layer of a semiconductor structure efficiently. Moreover, in said method, this invention can not only save a mask in the manufacture, but also raise the capacitance of the metal-metal capacitor by extending the electrode of the metal-metal capacitor.
priorityDate 2002-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.