| abstract |
There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, in which a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5x10<SP>-5</SP> q γ given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5x10<SP>-5</SP> (m . sec/N). |