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publicationDate 2003-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200305972-A
titleOfInvention Via filling method
abstract A via filling method that provides superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/P ratio, the ratio of the electric current densities between the forward electrolysis and the reverse electrolysis, is in the range of 1/1 to 1/10 in a PPR electric current method applied with a cycle wherein the forward electrolysis interval is from 1 to 50 msec and the reverse electrolysis interval is from 0.2 to 5 msec.
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