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filingDate 2003-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200304960-A
titleOfInvention Chemically and electrically stabilized polymer films
abstract Preparation methods and stabilization processes for low k polymers that consist of sp2C-X and HC-sp3Cα-X bonds. A preparation method is achieved by controlling the substrate temperature and feed rate of the polymer precursors. One stabilization process includes a post annealing of as-deposited polymer films under the presence of hydrogen under high temperatures. The reductive annealing of these films is conducted at temperatures from -20 DEG C to -50 DEG C to +20 DEG C to +50 DEG C of their Reversible Crystal Transformation ("CRT") temperatures, then quenching the resulting films to -20 DEG C to -50 DEG C below their "CRT" temperatures. The reductive annealing is conducted before the as-deposited film was removed from a deposition system and still under the vacuum. "Re-stabilization" processes of polymer surfaces that are exposed to reactive plasma etching are also disclosed; thus, further coating by barrier metal, cap layer or etch-stop layer can be safely applied.
priorityDate 2002-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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