| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F5-00 |
| filingDate |
2003-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a3703ad0a5b5ae378df05af0fda84ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1128914b4a007453bec15da17ed9d1bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18e52138b4a6552a668ea877a1f7eb27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1d48f7fe9c2a6fde607837b45793d8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_582f6dfdbb0c3c506a9166a8f0b8294f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1f92966e40d42a2309727fc55099f53 |
| publicationDate |
2003-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200303243-A |
| titleOfInvention |
Electrochemical machining device, and substrate processing apparatus and method |
| abstract |
An electrochemical machining using pure water, preferably extrapure water or the like is used to substitute part or all of the substrate processing process using Chemical Mechanical Polishing (CMP), whereby the load of the CMP can be reduced and a machining with high flatness can be performed at high efficiency. The substrate processing apparatus comprises a chemical mechanical polishing part 24 for polishing a surface of a substrate in a chemical mechanical way, an electrochemical machining part 26 wherein a power feeding electrode and a machining electrode are provided and a ion exchanger 48 is disposed at least either between the substrate and the machining electrode or between the substrate and the power feeding electrode and an electrochemical machining in presence of liquid to the surface of the substrate is performed while voltage is applied between the power feeding electrode and the machining electrode, and a top ring 74 which can hold a substrate detachably and is movable between the chemical mechanical polishing part 24 and the electrochemical machining part 26. |
| priorityDate |
2002-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |