| abstract |
The present invention relates to a high resolution photoresist material of an acid generating agent, which has a high sensitivity to high energy beams, a high resolution, a small roughness to the line edge, an excellent thermal stability and storage stability, the use of the photoresist material, and a method for forming a pattern by using the photoresist material. A chemically amplified positive resist material comprises a base resin, an acid generating agent, and a solvent, is characterized in that the acid generating agent generates a chemically amplified positive resist material of a fluoro-containing alkyl imide acid, and includes a method of forming a pattern that comprises: coating the photoresist material on a substrate; after a thermal treatment, using a photomask to perform an exposure with a high energy beam of a wave length less than 300 nm; and after the thermal treatment, developing with a developer. |