| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76886 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2002-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f03eef3340c5a1501a97a5788d158bf2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2004bae0783ebf5555db0e639843694
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f16277c95e27c42d7c4642bcd887dab7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63eaab1acff6cebfc49c480056dbbcaf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19f00e8c4eedd6f1ffe8af466ce50d79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e381ad63fcc23ae2c01537e9762990c |
| publicationDate |
2003-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200301524-A |
| titleOfInvention |
Method for improving electromigration performance of metallization features through multiple depositions of binary alloys |
| abstract |
The reliability and electromigration performance of planarized metallization patterns in an electrical device, for example copper, inlaid in the surface of a layer of dielectric material overlying a semiconductor substrate (1), are enhanced by a method for more reliably and uniformly diffusing into a metallization feature (9') alloying elements which reduce or substantially prevent electromigration. The method emprises depositing around a metallization feature (9') metal alloy films (8) and alloying layers (11) comprising one or more alloying elements having physical and/or chemical attributes which are effective for minimizing or substantially preventing electromigration along grain boundaries and/or along the interface between the surfaces of the metallization feature (9') and other surfaces. The metal alloy films (8) and alloying layers (11) are advantageously deposited where their particular physical and/or chemical attributes may be most beneficial for improving electromigration performance. The alloying elements may then be diffused into the metallization feature (9') to effect alloying therewith. |
| priorityDate |
2001-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |