| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59aeacfc8c0fb15a69d7dd77723e2c36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F38-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L49-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F38-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-06 |
| filingDate |
1973-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1981-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_448a155ea0d92bfce31d792cd98b197f |
| publicationDate |
1981-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
SU-867317-A3 |
| titleOfInvention |
Thermoresistant thermosetting composition |
| abstract |
The invention relates to thermosetting compositions which are blends of novel poly(arylacetylenes) and, as fluidizers, certain aromatic organic compounds containing at least two aromatic rings. The poly(arylacetylenes) are prepolymers of polyacetylenically substituted aromatic compounds, which prepolymers have a number average molecular weight of from about 900 to about 12,000 and contain from about 5 to 20% by weight of acetylenic groups. Diethynylbenzene is one of the preferred monomers used in preparation of the prepolymers. Representative of the compounds containing at least two aromatic rings are anthracene, phenanthrene and diphenylmethane. The compositions are curable by heat to produce thermoset resins which have very desirable physical properties at both normal and high temperatures. |
| priorityDate |
1972-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |