http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SU-1696602-A1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-10
filingDate 1989-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1991-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2a9017ec6e0c613aab3252a0d25af76
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publicationDate 1991-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber SU-1696602-A1
titleOfInvention Method of manufacturing relief plates
abstract The invention relates to electroforming, in particular to the manufacture of embossed forms with uneven elements. intended for the manufacture of products for various purposes. The purpose of the invention is to expand the range of products obtained. A photopolymerizable composition is applied to the metal substrate. Exposure through the photomask and the corresponding relief of the photopolymer layer at different depths, depending on the desired relief of the product, is based on the C 2.3 a ratio, where C is the depth of the appearance and a is the minimum width of the opaque photomask elements. After the occurrence, galvanic deposition of metal of the required thickness is performed and the resulting form is separated.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2492278-C2
priorityDate 1989-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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