http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-192419-A1

Outgoing Links

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filingDate 2009-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7839ff9f5c703f4df789dca57bc41b6
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publicationDate 2013-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber SG-192419-A1
titleOfInvention Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material
abstract 34 OF THE DISCLOSUREA semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5mass% or above in terms of oxides, wherein the Al content in the particle size region of 15 gm to less than 70 µm is 100to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 gm to less than 15 gm is 100 to 7000ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 gm to less than 70 gm to theAl content (B) in the particle size region of 3 gm to less than 15 gm be 1.0 to 20.(no suitable figure)
priorityDate 2008-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Incoming Links

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Total number of triples: 24.