| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c78d80e9d323ad7c79518c80e0b8d16 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F30-39 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F17-50 |
| filingDate |
2003-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2a7ccbcb0e0025f698a4b538e693039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_056eae10609b513ab10b38c23a6713dd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3cd2af88631b956bc656fdf5ba68ed7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08e279efb2493e8f3a3a574b98c4d950 |
| publicationDate |
2007-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
SG-137655-A1 |
| titleOfInvention |
Device, design and method for a slot in a conductive area |
| abstract |
A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by including symmetric or square slots inside selected wide metal lines, by adhering to a set of placement rules. Embodiments reduce dishing in copper dual damascene structures. Embodiments reduce data processing requirements for designing and arranging the layout of IC devices and the slots. |
| priorityDate |
2003-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |