http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-11201407845V-A

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filingDate 2013-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dbf3d6773269f0bb1198762c975037b
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publicationDate 2014-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber SG-11201407845V-A
titleOfInvention Photoactivated etching paste and its use
abstract (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 12 December 2013 (12.12.2013) WIPOIPCT (10) International Publication Number WO 2013/182265 A1 (51) International Patent Classification: H01L 31/18 (2006.01) C09K13/04 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/EP2013/001354 7 May 2013 (07.05.2013) English English (30) Priority Data: 12004239.5 4 June 2012 (04.06.2012) EP (71) Applicant: MERCK PATENT GMBH [DE/DE]; Frank­ furter Strasse 250, 64293 Darmstadt (DE). (72) Inventors: NAKANOWATARI, Jun; 3-19-8 Higashi- hasimoto, Kanagawa Pref., Sagamihara-City 229-1104 (JP). GOTO, Tomohisa; 1-5-2 Nishihasimoto, Sagamihara 252-0131 (JP). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). [Continued on next page] (54) Title: PHOTOACTIVATED ETCHING PASTE AND ITS USE Fig. 1 1, Coating photo-etch paste on the TCO substrate 2, Apply UV irradiation through photo mask UV light ^ ^ UV light I I Photo-etch paste *-»— TCO layer Glass or film substrate Photo-mask 3, Cleaning and washing Patterned TCO layer CJ CJ oo i-H o CJ o & [Continued on next page] WO 2013/182265 A11 lllll llllllll II llllll III lllll lllll III III III lllll lllll lllll lllll lllll llll llll lllllll llll llll Published: — with international search report (Art. 21(3)) (57) Abstract: The improved method for the etching of transparent conductive oxide layers placed on flexible polymer substrates, hard substrates like glass or on silicon wafers comprises the use of new etching pastes, which are activated by irradiation.
priorityDate 2012-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 19.