http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SE-428805-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd9a03cda79881b369e4bec8c6fb31a6 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 |
| filingDate | 1978-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_237c126f7ce98769aa50e46b787beecd |
| publicationDate | 1983-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | SE-428805-B |
| titleOfInvention | SET FOR POWERFUL DEPOSITION OF TIN LAYERS ON COPPER AND COPPER ALLOY |
| abstract | Process for the current-free deposition of a layer of tin on copper metal or copper alloys, in which the surface of the copper or copper alloy is treated with an aqueous solution of stannous oxide ions and a thiocyanate, without the involvement of thiourea. |
| priorityDate | 1978-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.