| abstract |
17 ABSTRACT The invention relates to a device comprising a base substrate (700) With a microcomponent (702) attached thereto. Suitably it is provided With routing elements(704) for conducting signals to and from said component (702). It also comprisesspacer members (706) Which also can act as conducting structures for routingsignals vertically. There is a capping structure (708) of a glass material, providedabove the base substrate (700), bonded via said spacer members (706), preferablyby eutectic bonding, Wherein the capping structure (708) comprises vias (710)comprising metal for providing electrical connection through said cappingstructure. The vias can be made by a stamping/pressing method entailing pressingneedles under heating to soften the glass and applying pressure, to apredetermined depth in the glass. HoWever, other methods are possible, e-g- drilling, etching, blasting. (Fig. 7a) |