| abstract |
FIELD: electrical equipment.SUBSTANCE: invention can be used in producing soldered joints of parts, particularly for securing power semiconductor microcircuits on metal-coated ceramic substrates, for example MID-bases, carrying boards. Connectable parts (12A, 12B) by means of adhesive (18) are temporarily connected to soldered assembly (10) with their fixation in position of connection. Brazed assembly (10) is heated to intermediate temperature below solder alloy (16) at atmospheric pressure. First, pressure in process chamber (74) is reduced to pressure higher than evaporation pressure of adhesive (18) at intermediate temperature so that adhesive (18) is not evaporated yet. For cleaning of soldered assembly (10) cleaning device, in particular formic acid, hydrogen or plasma is introduced into process chamber (74). Then pressure in process chamber (74) is reduced to pressure below evaporation pressure of adhesive (18) at intermediate temperature.EFFECT: use of adhesive provides reliable fixation of a soldered assembly, and preset temperature mode and regulation of pressure in chamber allows connecting parts without shrinkage cavities.18 cl, 14 dwg |