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publicationDate 2017-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber RU-2632267-C2
titleOfInvention Structure of photoconverter based on crystalline silicon and its production line
abstract FIELD: physics. n SUBSTANCE: structure of the photoconverter based on crystalline silicon includes: a textured polycrystalline or monocrystalline silicon plate; a passivation layer in the form of amorphous hydrogenated silicon deposited on each side of the silicon plate; p-layer; n-layer; contact current-collecting layers in the form of transparent conductive oxides; a rear current-collecting layer in the form of a metallic opaque conductive layer, wherein metal oxides of p-type and n-type are respectively used as the p-layer and n-layer, wherein n-type and p-type layers, passivation and current-collecting layers are applied by magnetron sputtering method. Zinc oxide (ZnO) or SnO 2 , Fe 2 O 3 , TiO 2 , V 2 O 7 , MnO 2 , CdO, or other n-type metal oxides are used as n-type metal oxide. MoO, or CoO, Cu 2 O, NiO, Cr 2 O 3 , or other p-type metal oxides are used as p-type metal oxide. A production line for photoconverter based on crystalline silicon, including sequential operations, such as: cleaning and texturing crystalline silicon plates; depositing a passivation layer of amorphous hydrogenated silicon on each side of the silicon plate; application of the p-layer of the photoconverter; application of the n-layer of the photoconverter; application of contact current-collecting layers of the photoconverter; application of the rear current-collecting layer; final assembly, wherein sequential magnetron sputtering of the passivation layer, p-layer in the form of the p-type metal oxide, n-layer in the form of the n-type metal oxide, and current-collecting layers is performed by magnetron sputtering. In this case, a magnetron sputtering of the silicon target in an atmosphere of silane and argon with the addition of hydrogen can be carried out. n EFFECT: invention allows to increase productivity, reduce the dimensions of the production line, eliminate the need for overturning silicon plates in the production process. n 5 cl, 1 dwg
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