http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2548972-C2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b637f9f45afd69585579aa44456b785c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12493 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D13-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D13-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-4465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-4457 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-4492 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 |
| filingDate | 2011-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a99933f79dbc9a8fdda08b93e3581e20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31dfddec6f8a97879fdfe63a7371f216 |
| publicationDate | 2015-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | RU-2548972-C2 |
| titleOfInvention | Copper-containing solution for prewashing yttrium-containing electroplating composition to improve anticorrosion protection |
| abstract | FIELD: chemistry. n SUBSTANCE: invention relates to a method of electroplating a substrate that has not undergone pretreatment. The method includes (a) contacting at least part of substrate material with a solution containing a copper source and water, where the solution is substantially free of a group IIIB metal source and a group IVB metal source, (b) bringing at least part of the substrate into contact with an electroplating composition containing (i) a film-forming resin and (ii) a yttrium source. Also described is a coated substrate and a method of electroplating a substrate, which includes (a) contacting at least part of substrate material with a solution containing a copper source, water and at least one substance selected from acids and surfactants, followed by contacting at least part of the substrate with an electroplating composition. n EFFECT: corrosion resistance of the substrate material without a compulsory pretreatment step. n 20 cl, 9 tbl, 10 ex |
| priorityDate | 2010-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 186.