http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2529125-C1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0119155b757a6c4d3ae84c7aba914924 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-14 |
| filingDate | 2013-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a47d8b32fdc4a5a6c8339fa4d56f1e5f |
| publicationDate | 2014-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | RU-2529125-C1 |
| titleOfInvention | Solution for laser-induced metallisation of dielectrics |
| abstract | FIELD: electricity. n SUBSTANCE: solution contains copper salt, deoxidant and surface-active component, and as the deoxidant it includes the lower aliphatic spirit such as methyl, ethyl, n-propyl or isopropyl spirit with the concentration 0.05÷2 mole/l of water solution. As a copper salt the solution can contain 0.02÷0.04 mole/l of copper chloride or 0.02÷0.6 mole/l of copper formiate. The solution is prepared just before the settling. n EFFECT: solution allows to metallise a dielectric surface at a high speed and to obtain continuous conductive copper paths conforming to the boards of 5 precision class. n 7 cl, 14 dwg, 6 ex |
| priorityDate | 2013-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.