| abstract |
FIELD: chemistry. n SUBSTANCE: composition contains the following (wt %): epoxy diane resin ED-20 51.81-63.82, mineral filler 15.54-19.16, ethylene diaminomethylphenol amine hardener 8.81-10.85, isopropylbenzene hydroperoxide 0.26-1.04, NK-1 accelerator 0.70-2.07 and antipyrene - phosphorus-containing methacrylate 5.21-20.73 of formula: n , where: x=1.2. n EFFECT: invention improves technological effectiveness of the antipyrene pre-synthesis process, enables to obtain chemically resistant epoxy diane compositions with low flammability and good physical and mechanical properties. n 2 tbl, 6 ex |