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filingDate 2002-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fdc0015f2274c13086fdea694e1b609
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publicationDate 2006-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber RU-2285067-C2
titleOfInvention Method of pickling layers applied to transparent substrates
abstract FIELD: pickling of layers applied to transparent substrates and weakly conducting layers for obtaining electrodes. n SUBSTANCE: proposed method includes bringing the sections of layer to be subjected to pickling in contact with solution, immersion of electrode in solution and placing it opposite section at distance "d" and application of voltage. Transparent substrate is provided with mask having pattern bounding many open sections of layer. Besides that, use is made of at least one electrode which is elongated in shape for simultaneous pickling on several open sections of layer in width 1. Method is also used for pickling the layer of tin oxide alloyed by fluorine or indium tin oxide. Transparent substrate has layer subjected to pickling by this method. Shield for visualization of type of plasma shield includes this substrate. Device for electrochemical pickling of sections of layer includes at least one electrode and conducting solution contained in bath in which electrode is immersed; electrode is elongated in shape for simultaneous pickling of several sections of layer in width 1. n EFFECT: avoidance of overpickling. n 28 cl, 10 dwg
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