| abstract |
FIELD: adhesives. SUBSTANCE: invention aims at hot joining of substrates, in particular composite substrates, with polymer matrix or metallic substrates, for example aluminum alloy substrates, without altering their characteristics. Composition contains at least one polymer material (polyesteramide), at least one plasticizer and wetting agent, in particular aromatic compound containing at least one functional group selected from propiophenone, benzophenone, diphenyl sulfone, ditolyl sulfone, phenyl benzoate, and benzophenol, and at least one solvent. Method is implemented by applying layer of glue composition onto at least one surface of at least one substrate to be joined and, if necessary, applying glue layer onto at least one glue composition layer, after which substrates are glued with each other, heating (if necessary under pressure) to temperature below decomposition temperature of substrates and lower than melting point of polymer material present in glue composition. If desired, joined assembly is cooled. Composition can be used to create aircraft-quality 'sandwich' structures, in particular for helicopter rotors. EFFECT: enabled gluing of reinforced polymer materials at lower temperatures and gluing different-nature substrates. 13 cl, 5 dwg, 1 tbl, 4 ex |