| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_893ace6883bb822106859c637927aa31 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate |
1995-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f994514abefdfede0a79cbb816355d2e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9232b3ea5f4a2072805c25723470e13f |
| publicationDate |
2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
RU-2151447-C1 |
| titleOfInvention |
Method for encapsulating electronic components; electronic component |
| abstract |
FIELD: electronic engineering. SUBSTANCE: method for encapsulating electronic components such as integrated circuits in sealing compounds includes at least the following stages: component to be encapsulated is placed in mold, encapsulating material heated to high temperature is introduced in space between mold and component to be encapsulated and cured; encapsulated component is removed from mold; encapsulating material has the following composition, percent by weight: thermoplastic material - 50-60; reactive solvent - 50- 40. Electronic component encapsulated by proposed method is described. EFFECT: reduced friability of compounds; provision for dispensing with their storage at low temperatures and with additional curing. 4 cl, 1 tbl, 1 ex |
| priorityDate |
1994-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |