| abstract |
FIELD: chemical industry. SUBSTANCE: epoxy compound comprises epoxy diane resin, hardener and modifier. Hardener is low molecular weight polyamide and modifier is dibutylphenyl phosphate containing polybutyl methacrylate, ratio of components being as follows, wt parts: epoxy diane resin, 100; low molecular weight polyamide hardener, 30; dibutylphenyl phosphate modifier containing polybutyl methacrylate, 30. EFFECT: higher elasticity reduced combustibility and good service properties at temperatures from -40 C to +130 C. 5 ex, 1 tbl |