http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2058872-C1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_27a69080ffbfd1d8c0b8009ea3ccc64c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30 |
| filingDate | 1994-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1996-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06d3542995a98f71537b9f57937ae317 |
| publicationDate | 1996-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | RU-2058872-C1 |
| titleOfInvention | Solder for soldering articles of electronic technics |
| abstract | FIELD: soldering. SUBSTANCE: proposed solder contains (mass %): tin 4-5, boron 0.4-0.6, titanium 34-36, lithium carbonate 0.4-0.6, zirconium 0.4-0.6 and copper the rest. EFFECT: improves quality of desired product. 1 tbl |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102211260-A |
| priorityDate | 1994-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.