http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2013467-C1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-46
filingDate 1991-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1994-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0f48dfc8b8bd3ad9a9bd8cbd4191692
publicationDate 1994-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber RU-2013467-C1
titleOfInvention Method of processing waste copper-ammonium solution for etching copper
abstract FIELD: manufacturing microcircuit. SUBSTANCE: waste copperammonium solution is corrected with the help of ammonium chloride and ammonia. The process is carried out at stage having minimal etching rate, washing waters of stamped array additionally containing sodium chloride are used. Quantity of components are determined according to formulae given in specification. EFFECT: improves efficiency of the method. 2 dwg, 7 tbl
priorityDate 1991-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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