http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2013467-C1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9c359d6f4bd33613c959147276d6ef65 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-46 |
filingDate | 1991-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 1994-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0f48dfc8b8bd3ad9a9bd8cbd4191692 |
publicationDate | 1994-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | RU-2013467-C1 |
titleOfInvention | Method of processing waste copper-ammonium solution for etching copper |
abstract | FIELD: manufacturing microcircuit. SUBSTANCE: waste copperammonium solution is corrected with the help of ammonium chloride and ammonia. The process is carried out at stage having minimal etching rate, washing waters of stamped array additionally containing sodium chloride are used. Quantity of components are determined according to formulae given in specification. EFFECT: improves efficiency of the method. 2 dwg, 7 tbl |
priorityDate | 1991-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.