| abstract |
1. A method of conductively connecting an electrical component to at least one conductive path or conductive layer, wherein the conductive path or conductive layer is applied to a light-permeable microcircuit board that is substantially visible in the light wavelength range, wherein the light-permeable microcircuit board contains a heat-absorbing layer, and the conductive layer is simultaneously a heat-absorbing layer selected from one or more of the following metal oxides: - lnOx: Sn, - SnOx: F, - SnOx: Sb, - ZnOx: Ga, - ZnOx: B, - ZnOx: F, - ZnOx: AI, with x tries It is worn between 1 and 2, depending on the concentration of the diffusant; comprising the following steps: - an electrical component or a conductive path or conductive layer is provided at a site where the structural element needs to be connected to the conductive layer or to the conductive path, solder material; - the solder material is automatically supplied with energy from an energy source emitting short-wave infrared radiation, so that the supplied energy is essentially introduced into the heat-absorbing conductive path or into the conductive layer at the place where you want to fix the element, t As solder material is melted and forms an integral continuous conductive connection between the electrical component and the conductive path or conductive layer with a minimum element load with a short soldering time of less than 30 s. 2. The method according to claim 1, characterized in that the soldering time is between 0.1 s and 10 s, between 1 s and 10 s. The method according to claim 2, characterized in that the soldering time is between 1 s and 10 s. The method according to |