| abstract |
1. A printed circuit board including:! a substrate comprising insulating material; ! a plurality of electrically conductive printing tracks attached to at least one surface of the substrate; ! a multilayer coating deposited on at least one surface of the substrate, wherein the multilayer coating covers at least a portion of the plurality of electrically conductive printing paths, the multilayer coating comprising at least one layer formed from a halocarbon polymer; and! at least one electrical component connected by a solder joint to the at least one electrically conductive printing path, the solder joint being soldered through a multilayer coating such that the solder joint abuts the multilayer coating. ! 2. The printed circuit board according to claim 1, in which the multilayer coating has a thickness of from 1 nm to 10 μm. ! 3. The printed circuit board according to claim 1, in which the multilayer coating includes a first layer and a second layer that are different from each other, and the first layer and the second layer include various polymers. ! 4. The printed circuit board according to claim 1, in which:! a multilayer coating includes a first layer comprising a polymer of a particular type; ! the multilayer coating includes a second layer comprising a polymer of a particular type; ! the polymer in the first layer differs from the polymer in the second layer with respect to at least one of the following properties:! molecular weight; ! chemical composition; ! structure; ! geometric shape; and! porosity. ! 5. The printed circuit board according to claim 1, in which:! the multilayer coating includes a separate layer of the first polymer and another layer of the second polymer, the layers adjacent to each other; and! layers |