http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2008130842-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2008-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | RU-2008130842-A |
| titleOfInvention | GLUE COMPOSITION |
| abstract | Adhesive composition including epoxy diane resin, polyamide resin (condensation products of polyethylene polyamine with methyl esters of dimerized fatty acids of vegetable oils), an organosilicon amine (bisparaaminophenyleneaminomethylene tetramethyl disiloxane-ethylenomethylene-yl-ethylenomethylene-yl-ethylenomethylene-yl-ethanomethylenediamine-1-methylene-ethylenediamine-1-ethylenomethylene-ethylenediamine-yl-methane-ethylenediamine , chlorine-containing resin with a mass fraction of chlorine of 2.5-22.0% (N, N, N ', N'-tetraglycidyl derivative of 3,3-dichloro-4,4-diaminodiphenylmethane, a condensate product epichlorohydrin with diphenylolpropane, a reactive chlorine-containing resin and the product of the interaction of epichlorohydrin with water) and an aliphatic di- or polyamine (dicyanethylethylenediamine, hexamethylene diamine, N, N, N ', N'-tetramethylhexamethylene diamine, and polyethylene, both thermoplastic polymer (polysulfone), as a hardener a mixture of the adduct of phenol, ethylene diamine, formaldehyde (AF-2) and organosilicon amine is used, and as a filler - shungite chips with a particle size of not more than 40 microns in the following ratio of components, parts by weight:! ED-20 brand epoxy resin 90-110 polyamide resin 35-55 organosilicon amine 1,15-1,30АФ-2 25-35 polysulfone 5-30 schungite chips 20-35 |
| priorityDate | 2008-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.