http://rdf.ncbi.nlm.nih.gov/pubchem/patent/PL-193388-B1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d75672b058b5ae5cbc470d6b07a0313b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
filingDate 2000-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d31c710e2453c4d51ef21d61e1cbfa8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee73b2332cc1ca85ef529e8b55101d04
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publicationDate 2007-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber PL-193388-B1
titleOfInvention Solder paste for surface mounting
abstract 1. Surface mount solder paste consisting of a mixture of soldernin the form of a powder and a flux in the form of a complex mixture of which they are includednrosin or derivatives thereof, solvents, activators and a thixotropic agent, characterizednin that it contains phenolic amine and / or phenol-naphthalene antioxidant in an amount from 0.1 ton2% by weight.
priorityDate 2000-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.