http://rdf.ncbi.nlm.nih.gov/pubchem/patent/PL-155555-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B02C2-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B02C- http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L- http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B02C15-00 |
| filingDate | 1987-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1991-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | PL-155555-B1 |
| titleOfInvention | Method for cleaning the surfaces of metal terminals of semiconductor devices from epoxy or silicone resin particles adhered to the terminals |
| abstract | . The method of cleaning the surface of metal leads of semiconductor devicesnof epoxy or silicone resin particles adhered to leads, is knownnalternatively, the adhered resin particles are separated from the metal surfaces by crushing. |
| priorityDate | 1987-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.