| abstract |
The present invention provides an alkali-soluble resin from which a cured film having a high degree of elongation, low stress, high metal adhesion, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin. The present invention is (A) an alkali-soluble resin characterized by having a structure represented by general formula (1) and satisfying (I) and (II). (I) 30-70 mol pcnt of an organic group having an aliphatic chain having 8-30 carbon atoms is contained as X1 of general formula (1) with respect to a total amount of 100 mol pcnt of X1 and X2. (II) 1-30 mol pcnt of an organic group having a diphenyl ether structure is contained as Y1 of general formula (1) with respect to a total amount of 100 mol pcnt of Y1 and Y2 (in general formula (1), X1 represents a divalent organic group having 2-100 carbon atoms, Y1 and Y2 represent an organic group having a valence of 2-6 and having 2-100 carbon atoms, X2 represents a tetravalent organic group having 2-100 carbon atoms, p and q represent an integer in the range of 0-4, and n1 and n2 represent an integer in the range of 5-100,000). |