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publicationDate 2017-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber PH-12016000004-A1
titleOfInvention Etchant solutions and method of use thereof
abstract ABSTRACT OF THE DISCLOSURE Etching compositions and method of using the etching compositions comprising potassium hydroxide; one or more than one additional alkaline compounds selected from the group consisting of TEAH, TMAF and NH40H; and water; or etching compositions comprising one or more than one inorganic alkali basic hydroxides selected from the group consisting of potassium hydroxide, cesium hydroxide, sodium hydroxide, rubidium hydroxide, or lithium hydroxide; optionally one or more than one additional alkaline compounds; water; and optionally one or more corrosion inhibitors; wherein the composition preferentially etches silicon present on a substrate as compared to silicon dioxide present on said substrate.
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