| abstract |
1,020,466. Semi-conductor devices. SEMIKRON GESELLSCHAFT FUR GLEICHRICHTERBAU UND ELEKTRONIC m.b.H. Aug. 4, 1964 [Aug. 5, 1963], No. 31633/64. Heading H1K. Terminals to a semi-conductor body are provided by inserting a U-shaped wire into a recess in a holder so that the semi-conductor body is clamped between the ends of the wire and then soldering the wires to the body and cutting the legs apart. Fig. 9 shows a section of a rod 19 comprising a plurality of recesses 18 containing wires 16 and Fig. 12 shows a semi-conductor element and associated metal base 8 clamped between the ends 16 and 15 of each of the wires. The rod 19 which acts as a holder may then be used to subject the plurality of semi-conductor elements and associated wires to various treatments; they may be inserted into a solder bath to solder the wires to the elements and other containers to effect cleaning, etching, drying, coating with resin, rubber or silicone &c. The elements are then removed from the recesses and the U-bend cut to provide separated electrodes for each element. In one embodiment a further rod also with recesses which co-operate with the recesses in the first rod is used, whereby the semiconductor elements and wires are inserted into a corresponding plurality of plastic containers each containing hot potting compound. The semi-conductor body may consist of silicon with a PN junction produced by heating a body coated with boric acid on one surface and phosphoric acid on the other to effect diffusion of boron and phosphorus; a plurality of bodies separated by aluminium oxide may be treated in this way. The semi-conductor faces may be coated with nickel and then gold, tin, or a leadsilver-copper alloy to facilitate soldering. The associated metal element 8 may consist of a nickel-iron-cobalt alloy and the wires of silvercoated copper. A plurality of wires may be connected together in the same soldering process to provide a series of bridge-connected rectifiers. |