http://rdf.ncbi.nlm.nih.gov/pubchem/patent/MY-188765-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_873f0a15765efdb315f2843f4ea0f176
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2607-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2111-0062
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B22-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B13-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B28-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B22-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B22-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B14-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B22-16
filingDate 2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_243a1a5da46d86e2e1ee30586aa6f882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92ffd53d922cd3319a8e0a5397853643
publicationDate 2021-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber MY-188765-A
titleOfInvention Gypsum product composition, gypsum products, and a method for using a compound in gypsum board
abstract A gypsum board composition was disclosed which comprises stucco, adhesive, water and additive for improving bonding, wherein the additive for improving bonding is shown in chemical formula as MIMII(OH)2(An-).mH2O, wherein MI is a divalent metal ion, MII is a trivalent metal ion, and An- is an interlayer anion, and wherein MI and MII are different metals. Also, a gypsum board made with the composition of the above and a method for using a compound shown in the aforesaid chemical formula were disclosed.
priorityDate 2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635

Total number of triples: 21.