patent/MY-185884-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/MY-185884-A

Outgoing Links

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filingDate	2014-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bf254c11e0ddae6521d536a22b21fd8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c3fce7c93c9f114e261f9ea1b9c936c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c972cce10119cbd6ddfd705eda5cf9df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c6ec9e6cfba0f77dbf32a9c96eca6ab
publicationDate	2021-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	MY-185884-A
titleOfInvention	Epoxy resin composition, semiconductor sealing agent, and semiconductor device
abstract	An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass% of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 4 7 to 75 mass% of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass% of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass% in total. Figure 2
priorityDate	2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 63.