| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| filingDate |
2005-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a21cc025e9772171e9d54852a388451 |
| publicationDate |
2013-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
MY-148463-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
AN EPOXY RESIN COMPOSITION COMPRISING (A) AN EPOXY RESIN (B) A PHENOL RESIN, (C) A CURING ACCELERATOR, (D) SILICA, AND (E) ALUMINA AND/OR ALUMINUM HYDROXIDE, WHEREIN THE AMOUNT OF ALUMINUM TO THE TOTAL AMOUNT OF THE EPOXY RESIN COMPOSITION IS 0.25-5 WT % AND 70 WT % OR MORE OF THE SILICA HAS AN AVERAGE PARTICLE SIZE OF 25 ?M OR LESS. THE EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATING AND A SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR ELEMENT ENCAPSULATED USING THE COMPOSITION POSSESS EXCELLENT CHARACTERISTICS IN RELIABILITY DURING HIGH TEMPERATURE OPERATION. |
| priorityDate |
2004-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |